Product Description
Ceramic Grinding Disc
Precision Craftsmanship, Achieving Perfection in Grinding
Core Advantages
- High-Efficiency Grinding: Utilizes premium alumina abrasives with high hardness and exceptional wear resistance, significantly enhancing grinding efficiency.
- Long-Lasting Durability: Treated with specialized processes, the disc features a compact structure and extended service life, reducing operational costs.
- Wide Applicability: Suitable for rough grinding, fine grinding, and polishing of various metal and non-metal materials.
- Stable and Reliable Performance: Resistant to clogging during grinding, ensuring consistent and stable grinding results.
Application Scenarios
- The wafer ceramic grinding disc is a critical process equipment used in semiconductor manufacturing, primarily for flattening and polishing hard materials such as silicon wafers.
Technical Highlights
- Unique Formulation: Optimized abrasive ratio to improve grinding efficiency and surface finish.
- Advanced Manufacturing Process: High-temperature sintering technology enhances the strength and wear resistance of the grinding disc.
- Precision Machining: Strict control over dimensional accuracy and dynamic balance ensures smooth and stable grinding operations.
Notes: Regular product samples charge a sample fee, and special ones charge a development fee (specifically based on the drawings and quantity).
Product Parameters
Ceramic Plates |
Regulation |
Unit Price |
abrasive disk |
Φ485*16mm |
$414.86 |
abrasive disk |
Φ230*12mm |
$551.54 |
abrasive disk |
Φ360*15mm |
$687.00 |
abrasive disk |
Φ520*20mm |
$687.00 |
abrasive disk |
Φ546*15mm |
$414.86 |
Ceramic plate |
Φ127*5.1mm |
$109.92 |
Ceramic plate |
Φ110*5mm |
$109.92 |
abrasive disk |
Φ576*20mm |
$687.00 |
Turntable |
307*Φ302*15mm |
$274.40 |
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